First smartphones With Dimensity 8100 and 8000 announced, coming in March

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After announcing the Dimensity 9000, MediaTek has released the Dimensity 8000 and 8100, which compete with Qualcomm in the high-end market. Both are 5 nm devices, and their internal components are almost identical. Because of its winning silicon lottery ticket, the 8100 is able to operate at higher clock speeds. Dimensity 1300, a minor enhancement over the 1200, is also available.

There are four Cortex-A78 huge CPU cores and four A55 little ones in each of the two 8000 processors. This is a Mali-G610 MC6, which is based on ARM’s newest GPU technology. The GPU frequency of the Dimensity 8100 is 20% greater than that of the 8000. In GFXBench Manhattan (offscreen), the 8100 scored 170 fps, whereas the 8000 scored 140 fps.

FHD+ resolution and 168 Hz refresh rate are supported by both processors. The 8100 processor is unique in that it also supports 120 Hz at WQHD+ resolution. It’s also equipped with 4K AV1 video decoders, which means it can modify HDR10+ content to take into account changes in lighting.

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The Imagiq 780 ISP can record 4K 60 fps HDR10+ video from one camera at a rate of 5 gigapixels per second while concurrently recording HDR video from two cameras. With a natural 2x lossless zoom and AI-powered noise reduction for HDR shooting, this ISP can handle cameras with up to 200MP sensors.

For up to 200 MHz of bandwidth, both chipsets include 5G modems (3GPP Release 16). A download speed of 4.7 Gbps is possible. Dual Standby mode and 5G+5G Dual SIM are supported by the modem.

Wi-Fi 6E (2×2), Bluetooth 5.3, and Bluetooth LE Audio with Dual-Link True Wireless Stereo Audio are all supported in the local area, as well. B1C frequency support is part of the positioning.

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Dimensity 1200
Dimensity 8000 Dimensity 8100 Dimensity 9000
Node 6 nm 5 nm 5 nm 4 nm
CPU (big) 1x Cortex-A78 @ 3.0 GHz 1x Cortex-X2 @ 3.05 GHz
CPU (medium) 3x Cortex-A78 @ 2.6 GHz 4x Cortex-A78 @ 2.75 GHz 4x Cortex-A78 @ 2.85 GHz 3x Cortex-A710 @ 2.85 GHz
CPU (small) 4x Cortex-A55 @ 2.0 GHz 4x Cortex-A55 @ 2.0 GHz 4x Cortex-A55 @ 2.0 GHz 4x Cortex-A510 @ 1.8 GHz
RAM LPDDR4X (up to 4,266 Mbps) LPDDR5 (up to 6,400 Mbps) LPDDR5 (up to 6,400 Mbps) LPDDR5X (up to 7,500 Mbps)
Storage UFS 3.1 UFS 3.1 UFS 3.1 UFS 3.1
GPU Mali-G77 MC9 Mali-G610 MC6 Mali-G610 MC6 (20% faster than 8000) Mali-G710 MC10
Display FHD+ @ 168 Hz FHD+ @ 168 Hz FHD+ @ 168 Hz, WQHD+ @ 120 Hz FHD+ @ 180 Hz, WQHD+ @ 144 Hz
Camera (stills) 200 MP 200 MP (5 Gpixel/s IPS) 200 MP (5 Gpixel/s IPS) 320 MP (9 Gpixel/s IPS)
Camera (video) 4K @ 60 fps 4K @ 60 fps (HDR10+), dual recording 4K @ 60 fps (HDR10+), dual recording 4K @ 60 fps (HDR10+), triple recording
5G 4.7 Gbps downlink, 2.5 Gbps uplink 4.7 Gbps downlink 4.7 Gbps downlink 7 Gbps downlink, 2.5 Gbps uplink
Wi-Fi Wi-Fi 6 (2×2) Wi-Fi 6E (2×2) Wi-Fi 6E (2×2) Wi-Fi 6E (2×2)
Bluetooth 5.2 5.3 5.3 Bluetooth 5.3

The sole difference between the Dimensity 1300 and the 1200 is the NPU’s enhanced performance, which provides additional number-crunching capacity for night mode and HDR processing with artificial intelligence.

The first Dimensity 1300, 8000, or 8100 chipset-powered smartphones will hit the market in the first quarter of 2022, so anticipate a flurry of releases in March from “some of the world’s top smartphone manufacturers” thereafter. Source

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