Apple’s MacBook, Mac, and iPad lineups all employ the current M1 silicon, therefore the corporation need a large number of these processor
A key component of current high-density chips with circuit connections is the FC-BGA substrate manufactured by Samsung
To make the future M2 chip, the so-called Samsung Electro-Mechanics arm is nearing an agreement to create the identical FC-BGA substrate
An major factor in the success of Apple’s M1 processor was the work done by Samsung Electro-Mechanics (SE). Specifically